Capability	Specifications	Applications	Benefits
Any-Layer HDI	50 µm/50 µm trace/space, 0.10 mm micro-vias, 1+N+1 to 3+N+3	Mobile, IoT, wearables, 77 GHz radar, ADAS cameras	Ultra-compact designs, supports 0.4 mm BGA, short signal paths for high-speed SerDes
High-Layer Backplanes	Up to 70 layers, 7 mm thick, 42:1 aspect ratio	Data-center switches, AI servers, 5G base-band units, C4ISR racks	Monolithic routing of thousands of differential pairs, minimizes crosstalk
Thick Copper	Up to 6 oz (inner/outer)	EV traction inverters, industrial motor drives, circuit-breakers	High current capacity, lower Joule losses, improved thermal spreading
Back-Drill	6 mil drill, 10 mil depth, ≤12 mil stub	25-56 Gb/s Ethernet, optical DSP, test equipment	Removes via stubs, tightens eye-diagrams, extends channel reach
Tight Impedance Control	±5% inner, ±10% outer	DDR5 boards, high-speed SERDES, automotive Ethernet	Lowers bit-error rates, eases EMI qualification
Large Panel Size	560 x 711 mm	LED displays, solar inverters, aviation flight controls	Consolidates multiple zones, cuts interconnects and assembly time
Via-in-Pad Resin Plug	Resin-plugged and plated vias	RF front-end modules, LTE/5G SiPs, ultrasonic probes	Shortens RF paths, improves thermal conduction
High-Aspect Micro-Vias	Stacked and capped, <1 mm board thickness	Foldable phones, medical implants, mini-satellites	Dense interconnects, critical for low Z-height and weight

Notes: Empowering next-gen electronics with precision, scalability, and reliability.

Layer Count	Lead Time	Notes
2 Layers	2-3 days	Ideal for rapid prototyping of simple designs
4 Layers	3-4 days	Suitable for compact IoT and automotive ECUs
6 Layers	4-6 days	Supports HDI with micro-vias for complex modules
8 Layers	5-8 days	Perfect for high-density RF and power designs
10+ Layers	Case-by-case	Custom solutions for advanced backplanes

Notes: Fast-track your designs with industry-leading turnaround times.

Parameter	Specification	Applications
Layer Count	2–70 Layers	From IoT modules to AI server backplanes
Materials	FR4 (TG140–180), Halogen-free, Rogers, Isola, Polyimide	Aerospace, medical, telecom, automotive
Max Copper Thickness	6 oz (inner/outer)	High-power EV and industrial drives
Min Line Width/Space	2 mil/2 mil (prototype), 4 mil/4 mil (production)	High-speed SerDes, fine-pitch BGAs
Min Drilling Hole	4 mil (0.1 mm)	Dense interconnects for compact devices
Max Aspect Ratio	42:1	High-layer backplanes, reliable vias
Max Board Size	560 x 711 mm	Large-scale LED arrays, flight controls
Board Thickness	0.2 mm (2L) to 7 mm	Ultra-thin wearables to robust backplanes
Surface Finishing	ENIG, Immersion Tin/Silver, OSP, Lead-free HASL, Hard Gold	Automotive, RF, high-reliability systems
Solder Mask Colors	Green, Matte Green, Black, Matte Black, White, Blue, Red	Customizable for branding and functionality

Notes: Scalable solutions for high-volume production with unmatched precision.