Production Capability

Featuring
 
1. With capability on producing Probe Cards & Load boards.
 
 
2. Years of experience on manufacturing high layer-count PCBs with blind/buried viasHDI (any-layer) for IC testing. 
 
 
3. Laser Direct Imaging Machines have been used for the best accuracy on registration.  The tolerance can reach to +/-0.5mil (+/-12um). 
 
 
4. Quick turn service for the prototype.

HDI

 

Types of HDI

1+N+1, 1+1+N+1+1, 1+1+1+N+1+1+1, 2+N+2, 3+N+3 & Any layer

Min line width/space

2mil/2mil

Min mechanical drilling hole diameter

6mil(0.15mm)

Min laser drill diameter:

4mil (0.1mm)

The ratio of hole depth to drill diameter (aspect ratio)

43

PCB Surface Finishing

Immersion Gold, Tin, Silver、OSP、Leadfree HASL、HASL、Carbon、Peelable Mask、Gold Finger

Color of Solder Mask

Green、Black、White、Blue、Red

 


Prototype Quick turn


Except our advanced capability such as HDI (any layer), copper fill plating, epoxy via plug etc..., we can also laminate mix-material like ROGERS+FR4 or ISOLA+FR4.
 

Layer Count

1 - 32L

Materials

FR4 (TG140、150、155、170、180)、Halogen-free、Rogers、PB free, Isola

Max copper thickness

10oz

Min copper thickness

1/3oz (Inner)

0.7oz (Outer)

Min line width/space

2mil/2mil

Min drilling hole diameter

4mil (0.1mm)

Max Aspect Ratio

24

Max Finished Board Size

700mm x 550mm

Max Board thickness

8.0mm +/-10%

Min Board thickness

2L: 0.3mm
4L: 0.4mm
6L: 0.6mm
8L: 1.0mm
10L: 1.0mm
12L: 1.2mm

PCB Surface Finishing

Immersion Gold, Tin, Silver、OSP、Leadfree HASL、HASL、Carbon ink、Peelable Mask、Gold Finger

Color of Solder Mask

Green/Matte Green 、Black/Matte Black、White、Blue、Red, Yellow

Special Technology

Blind & Buried via, Controlled Impedance (+/-5%), Epoxy via plug, Copper fill plating, Laser drill,Class 3  

 

 

Time is always precious. Glocom have supported countless customers to make their valued design to the prototype in shortest time.

 

Layers count Leadtime
2L 2~3  days
4L 3~4  days
6L 4~6  days
8L 5~8  days
10L or above by case

 


Mass production

 

 

Layer Count

2 - 50L

Materials

FR4 (TG140、150、155、170、180)、Halogen-free、Rogers、PB free

Max copper thickness

6oz

Min copper thickness

1/3oz

Min line width/space

2mil/2mil

Min drilling hole diameter

4mil(0.1mm)

Max Aspect Ratio

43

Max Finished Board Size

22” x 28”

Max Board thickness

6.35mm

Min Board thickness

2L: 0.2mm
4L: 0.3mm
6L: 0.4mm
8L: 0.6mm

PCB Surface Finishing

Immersion Gold, Tin, Silver、OSP、Leadfree HASL、HASL、Carbon、Peelable Mask、Gold Finger

Color of Solder Mask

Green、Black、White、Blue、Red

Special Technology

Blind & Buried via, Controlled Impedance, Epoxy via plug, Copper fill plating, Laser drill,Class 3