Production Capability
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1. With capability on producing Probe Cards
Load boards.
2. Years of experience on manufacturing high
layer-count PCBs with blind/buried; HDI for
IC testing.
3. Laser Direct Imaging Machines have been
used for the best accuracy on registration.
The tolerance can reach to +/-0.5mil (+/-12um)
4. Quick turn service for the prototype.
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Types of HDI |
1+N+1, 1+1+N+1+1, 1+1+1+N+1+1+1, 2+N+2, 3+N+3 & Any layer |
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Min line width/space |
4mil/4mil |
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Min mechanical drilling hole diameter |
6mil(0.15mm) |
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Min laser drill diameter： |
4mil (0.1mm) |
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The ratio of hole depth to drill diameter (aspect ratio) |
43 |
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PCB Surface Finishing |
Immersion Gold, Tin, Silver、OSP、Leadfree HASL、HASL、Carbon、Peelable Mask、Gold Finger |
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Color of Solder Mask |
Green、Black、White、Blue、Red |
Except our advanced capability such as HDI (any layer), copper fill plating, epoxy via plug etc..., we can also laminate mix-material like ROGERS+FR4 or ISOLA+FR4.
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Layer Count |
1 - 32L |
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Materials |
FR4 (TG140、150、155、170、180)、Halogen-free、Rogers、PB free, Isola |
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Max copper thickness |
10oz |
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Min copper thickness |
1/3oz (Inner) 0.7oz (Outer) |
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Min line width/space |
2mil/2mil |
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Min drilling hole diameter |
4mil (0.1mm) |
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Max Aspect Ratio |
24 |
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Max Finished Board Size |
700mm x 550mm |
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Max Board thickness |
8.0mm +/-10% |
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Min Board thickness |
2L: 0.3mm |
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PCB Surface Finishing |
Immersion Gold, Tin, Silver、OSP、Leadfree HASL、HASL、Carbon ink、Peelable Mask、Gold Finger |
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Color of Solder Mask |
Green/Matte Green 、Black/Matte Black、White、Blue、Red, Yellow |
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Special Technology |
Blind & Buried via, Controlled Impedance (+/-5%), Epoxy via plug, Copper fill plating, Laser drill,Class 3 |
Time is always precious. Glocom have supported countless customers to make their valued design to the prototype in shortest time.
| Layers count | Leadtime |
| 2L | 2~3 days |
| 4L | 3~4 days |
| 6L | 4~6 days |
| 8L | 5~8 days |
| 10L or above | by case |
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Layer Count |
2 - 50L |
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Materials |
FR4 (TG140、150、155、170、180)、Halogen-free、Rogers、PB free |
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Max copper thickness |
6oz |
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Min copper thickness |
1/3oz |
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Min line width/space |
4mil/4mil |
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Min drilling hole diameter |
4mil(0.1mm) |
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Max Aspect Ratio |
43 |
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Max Finished Board Size |
22” x 28” |
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Max Board thickness |
6.35mm |
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Min Board thickness |
2L: 0.2mm |
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PCB Surface Finishing |
Immersion Gold, Tin, Silver、OSP、Leadfree HASL、HASL、Carbon、Peelable Mask、Gold Finger |
|
Color of Solder Mask |
Green、Black、White、Blue、Red |
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Special Technology |
Blind & Buried via, Controlled Impedance, Epoxy via plug, Copper fill plating, Laser drill,Class 3 |